Does any variant of the GM02S SoC supports embed SIM technologies like iSIM or SoftSIM that would allow us to forgo having to populate a SIM card socket or eSIM IC on our boards?
If so, where can I find documentation related to implementing such technology in our products.
Thanks.
Dear Ben,
Thanks for your question.
The GM02S does technically support iSIM: the Monarch 2 chipset includes a Common Criteria EAL5+–certified Secure Enclave capable of hosting a SIM OS. However, the versions currently in production do not enable iSIM. This is intentional—we’ve held off to avoid ecosystem friction while key standards for in-factory profile provisioning (SGP.42) and remote SIM provisioning (SGP.32) continue to evolve and mature. These standards still need to be finalized, certified, and more broadly deployed.
As a result, for now you still need to populate a discrete SIM, which I understand is what you were hoping to avoid.
If helpful, we recently published a blog and related white paper that walk through smarter ways to leverage a soldered or plastic SIM with eSIM capability to achieve much of the flexibility customers expect from iSIM, without the ecosystem constraints. You can find the blog here: Simplifying IoT Manufacturing with Smarter eSIM Strategies - Sequans
Happy to discuss your specific use case if you want to explore options.
Kind regards,
Jeremy